UH110-UFM3 with Housing

UH110-UFM3 with Housing is a high-performance embedded SSD unit designed to replace traditional IDE disks in industrial systems. Thanks to 3D TLC memory and LDPC ECC technology, it offers enhanced reliability and operational longevity.

Advanced Performance

Equipped with a USB 2.0 interface, the device achieves read speeds up to 37 MB/s and write speeds up to 32 MB/s, with support for 4K Random Write IOPS up to 400.

Energy Efficiency

Operates on 5V ± 5% voltage and consumes only 95 mA in active mode, making it an ideal choice for low-power devices.

Durability and Safety

Certified to withstand temperatures from -40°C to +85°C, shock up to 1500G, and vibrations up to 7.69 Grms, ensuring safe operations even in critical environments.

Key Features:

• USB 2.0 interface with 10-pin connector
• 3D TLC NAND memory with LDPC ECC
• Capacity from 32GB up to 64GB
• S.M.A.R.T. support and advanced memory management
• High resistance to shock and vibration